JPS61168656U - - Google Patents

Info

Publication number
JPS61168656U
JPS61168656U JP1986041045U JP4104586U JPS61168656U JP S61168656 U JPS61168656 U JP S61168656U JP 1986041045 U JP1986041045 U JP 1986041045U JP 4104586 U JP4104586 U JP 4104586U JP S61168656 U JPS61168656 U JP S61168656U
Authority
JP
Japan
Prior art keywords
solar cell
electrically insulating
insulating resin
cell substrate
substrate according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986041045U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986041045U priority Critical patent/JPS61168656U/ja
Publication of JPS61168656U publication Critical patent/JPS61168656U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/52—PV systems with concentrators
JP1986041045U 1986-03-20 1986-03-20 Pending JPS61168656U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986041045U JPS61168656U (en]) 1986-03-20 1986-03-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986041045U JPS61168656U (en]) 1986-03-20 1986-03-20

Publications (1)

Publication Number Publication Date
JPS61168656U true JPS61168656U (en]) 1986-10-20

Family

ID=30550499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986041045U Pending JPS61168656U (en]) 1986-03-20 1986-03-20

Country Status (1)

Country Link
JP (1) JPS61168656U (en])

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008091440A (ja) * 2006-09-29 2008-04-17 Sharp Corp 太陽電池および集光型太陽光発電ユニット
JP2009188410A (ja) * 2008-02-11 2009-08-20 Emcore Corp Ｉｉｉ−ｖ属半導体太陽電池を使用する集中太陽光発電システムモジュール
US9923112B2 (en) 2008-02-11 2018-03-20 Suncore Photovoltaics, Inc. Concentrated photovoltaic system modules using III-V semiconductor solar cells

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4124824Y1 (en]) * 1964-08-19 1966-12-19
JPS5423489A (en) * 1977-07-25 1979-02-22 Japan Solar Energy Solar optical generator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4124824Y1 (en]) * 1964-08-19 1966-12-19
JPS5423489A (en) * 1977-07-25 1979-02-22 Japan Solar Energy Solar optical generator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008091440A (ja) * 2006-09-29 2008-04-17 Sharp Corp 太陽電池および集光型太陽光発電ユニット
JP2009188410A (ja) * 2008-02-11 2009-08-20 Emcore Corp Ｉｉｉ−ｖ属半導体太陽電池を使用する集中太陽光発電システムモジュール
US9923112B2 (en) 2008-02-11 2018-03-20 Suncore Photovoltaics, Inc. Concentrated photovoltaic system modules using III-V semiconductor solar cells

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